Interspectral will be exhibiting at RAPID TCT 2024! 

Interspectral will participate in RAPID + TCT, North America’s premier additive manufacturing event, from June 25-27, 2024, in Los Angeles. This event is a pivotal platform for the latest progressions in 3D technologies, featuring product announcements, exhibits, and insights from industry experts.

At RAPID + TCT, Interspectral will showcase a new version of AM Explorer, a software designed to integrate, fuse, and analyze data from the metal additive manufacturing process, including simulation, process monitoring, and post-build analysis.

The new version of AM Explorer includes several new features and improvements that will continue to improve both manual and automated quality assurance workflows.

The highlights include:

  • AI powered powder bed image analysis – automating quality assurance workflows
  • Modular AI integration – allowing 3rd parties and end users to integrate inhouse analytics with AM Explorer.
  • Annotation and reporting functionality
  • New visualization and filtering methods
  • New and updated integrations to market leading OEMs incl. EOS and Nikon SLM Solutions.

Interspectral will also showcase case studies featuring the majority of the large OEMs on the metal AM market including: Aconity3D, AddUp, Colibrium Additive, EOS, Freemelt, Nikon SLM Solutions, Renishaw, Trumpf and more.

The latest version of AM Explorer introduces a modular AI approach, enabling users to customize anomaly detection workflows for improved efficiency. This enhancement accelerates quality assurance by reducing manual review requirements, thereby saving time and costs.

“Artificial intelligence and automated anomaly detection are integral parts of our strategic roadmap. AM Explorer is designed to accelerate the quality assurance workflow, helping our customers cut costs and improve quality. We are dedicated to providing the AM industry with tailored state-of-the-art solutions, and this further enhancement will greatly improve the automated analysis capabilities”, says Isabelle Hachette, CEO at Interspectral.

In additive manufacturing, where each part’s uniqueness means slight parameter variations can significantly impact microstructure, AI for automated defect detection presents a significant opportunity to enhance inspection processes’ quality and efficiency. Detecting flaws in complex structural parts, particularly in aerospace and defence, remains challenging even for experienced operators.

For those interested in advancing their additive manufacturing operations, we invite you to visit Interspectral at booth #959, Hall G, during RAPID + TCT. Engage with our team to explore how our solutions can optimize your AM processes. To schedule a meeting with Interspectral at RAPID + TCT, please click here.

AM Explorer integrates with several large OEMs – this example shows a build job from an EOS M290 equipped with EOSSTATE Optical tomography and smart fusion. 

AM Explorer now includes AI powered automated powder bed image analysis. With the modular architecture end users can choose from off the shelf AI models or develop their own. 

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